1. CEE-100 SPINNER
The CEE spin coater system is used to distribute photoresist in a thin uniform layer by spinning the substrate. It has ten programs with maximum speed of 6000 RPM with an acceleration of 30,000 RPM/s and can spin substrates ranging from 0.5 to 2 inch in diameter.
2. HEATPULSE RTA
AG ASSOCIATES HEATPULSE 610 RAPID THERMAL PROCESSOR system is a rapid temperature processing system with center thermocouple or pyrometer to control temperature which allows ramp rate up to 70C/s. The system is manually loaded and capable of processing silicon and III-V substrates up to 3.5 inch size in diameter.
3. KARL SUSS Mask Aligner
The SUSS MJB 3 Mask Aligner is used in photolithographic processes to transfer a pattern from a mask to a photoresist coating on the substrate with high resolution. It suitable for handling wafers up to 3 inches in diameter and can be used for other samples with dimensions not exceeding 3 inches in any direction. The Aligner supports masks up to 4 inches.
4. DEKTAK-3 PROFILER
The Dektak-3 is a very high precision instrument capable of measuring minute physical surface variations with 10 angstroms vertical resolution. The scan length range is from 50 microns to 30 mm.
5. PE-50 PLASMA CLEANER
The Plasma Cleaner uses an active ionized gas (plasma) in a low pressure environment to descum and remove residual organics and thin oxides from samples. Sample size can vary from small pieces to 12in x 12 in x 4in.
6. WET BENCH
7. EDWARDS 306 (E-Beam)
The e-beam evaporator is used to coat samples with a wide variety of metals, such as gold, platinum and titanium. Unlike sputtered films, evaporators only coat the surface facing away from the substrate. It is equipped with a 4 pocket holder for depositing up to 4 metals during one process.